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parameter Layer: 18 l Material: FR4 Tg70. Thickness: 2.0 mm Copper thickness: 35/18/18/35um. Line width: 3.5/4 mil. Most holes: 0.2mm Surface treatment: ENIG(2U') Technical difficulties: photovoltaic products, 5G high frequency, Jangdan gold finger, local thick copper impedance.